The high temperature magnetic flap level gauge can be used for medium level detection of various towers, tanks, tanks, spherical vessels and boilers. It can be highly sealed, leakproof and suitable for high temperature, high pressure and corrosion resistance.
Common troubleshooting techniques for high temperature magnetic flap level gauges:
1. State adjustment method Generally speaking, before the fault is determined, do not touch the components in the circuit, especially the adjustable device, such as the potentiometer. However, if a reference is taken in advance (for example, position mark or measured voltage value or resistance value before untouched), it is allowed to be touched if necessary. Maybe after the change, sometimes the fault will be eliminated.
2, isolation method Fault isolation method does not require the same type of equipment or spare parts for comparison, and is safe and reliable. According to the fault detection flow chart, the segmentation and encirclement gradually narrows the fault search range, and then cooperates with the signal comparison and component exchange methods, and generally finds the fault location.
3, capacitor bypass method When a circuit produces a strange phenomenon, such as when the display is chaotic, you can use the capacitor bypass method to determine the part of the circuit that is probably faulty. Connect the capacitor across the power supply and ground of the ic; connect the transistor circuit across the base input or collector output to observe the effect on the fault. If the capacitor bypass input is inactive and the fault disappears when bypassing its output, it is determined that the fault is present in this stage of the circuit.
4. The observation method uses vision, smell, and touch. In some cases, damaged components will change color, blister or burnt spots; burnt devices will produce some special odor; short-circuited chips will be hot; visible or desoldered parts can also be observed with the naked eye. .
5, the elimination method The so-called elimination method is to insert the plug-in board, the device to determine the cause of the failure. When the instrument returns to normal after removing a board or device, the fault has occurred there.
6. The tapping pressure method often encounters good and bad phenomena when the instrument is running. Most of this phenomenon is caused by poor contact or virtual welding. For this case, tapping and hand pressing can be used.
The so-called "knocking" is to gently knock the board or part through a small rubber hammer or other tapping object to see if it will cause an error or a downtime. The so-called "hand pressure" is when the fault occurs, after the power is turned off, the inserted components and the plug and the seat are again pressed by hand, and then the power is turned on to try to eliminate the fault. If you find that the case is normal, and then knocking is not normal, you should first re-insert all the connectors and try again. If you are unsuccessful, you have to find another way.
7. Lifting and heating method Sometimes, the instrument works for a long time, or when the working environment temperature is high in summer, it will be faulty. The shutdown check is normal. After stopping for a while, the power is turned on again and normal. After a while, it will malfunction again. This phenomenon is caused by the poor performance of individual ICs or components, and the high-temperature characteristic parameters fail to meet the requirements of the index. In order to find out the cause of the malfunction, the temperature rise and fall method can be employed
The so-called cooling, that is, when the fault occurs, use cotton fiber to wipe the anhydrous alcohol in the part that may be faulty, to cool it, and observe whether the fault is eliminated. The so-called heating is artificially raising the ambient temperature, such as using a soldering iron to close the suspected part (be careful not to raise the temperature too high to damage the normal device) to see if the fault occurs.
8. The replacement method requires two instruments of the same type or sufficient spare parts. Replace a good spare with the same component on the faulty machine to see if the fault is eliminated.
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