By the Chinese Academy of micro- electronics -led Institute of IC pilot process research and development center (ten rooms), Application Specific Integrated Circuits and Systems Laboratory (two-compartment) mixed-signal analog IP team's commitment to "supporting the thermopile sensor chip" project, recently completed thermopile Analog front-end and high-precision temperature sensor chip test. Test results show that the chip has reached a high level of functionality and performance, is currently the first high-performance ASIC chip for thermopile applications.
In recent years, with the continuous improvement of infrared sensing technology, the non-refrigeration thermopile infrared detector fabricated by using the micro- mechanical system (MEMS) technology has the advantages of low energy consumption, light weight, compact size, short warm-up time and cost Low advantages and much attention. Because of its manufacturing process is compatible with standard CMOS technology, the structure is simple, reliable, easy and peripheral signal processing circuit monolithic integration, it has become the industry and research institutes hot spots.
Under the planning guidance of researcher Hei Yong, director of the second division, under the guidance of planning of the IPR module composed of the deputy researcher Hu Xiaoyu, Fan Jun and Chen Yingying, the key technologies of the peripheral chip supporting the thermopile are studied. The low noise and low offset simulation Front-end and high-precision temperature sensor chip development. Test results show that the performance of the chip reached the domestic first-class level. The low noise, low offset analog front end uses chopper technology, including a low noise low offset op amp and a precision Sigma-Delta analog-to-digital converter. The test results show that the chip has an effective detection precision of 9 bits and the linear gain of the analog front-end amplification gain is only 4.5% in the temperature range of -40 to 125 ° C. In the design of high-precision temperature sensor, the project team fully considered the non-ideal factors such as operational amplifier offset, BJT mismatch, current mirror mismatch, BJT process error and back-end quantization circuit misalignment. The discrete- The average control measurement ideas, combined with non-linear BJT gain correction, device mismatch correction and other technologies, the final design. Through the thermostat test, the temperature sensor in the range of 20 ~ 125 ℃, the detection accuracy control within ± 0.1 ℃.
At present, the project team focused on breaking through some key technologies of low-noise and low-offset analog front-end, and based on this, further explored the integration technology of high-performance thermopile sensor single chip, laid the foundation for R & D and industrialization of high performance infrared sensor supporting chip A good foundation.
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